RSS-FEED Polytec-2C-PAC - GETS YOU MOBILE

Most of the Polytec optical-grade epoxies are available in so called Polytec-2C-PACs. This allows... (11.04.2012) read more >>

Product Overview

Electrically Conductive Adhesives

  • Die Attach / COB
  • Solder replacement
  • Medial-grade applications
  • Flip chip packaging
  • SDM attach
  • Antenna printing
  • EMI/RFI shielding

Thermally Conductive Adhesives

  • Heat dissipation
  • Chip bonding
  • Heat sink bonding
  • Power semiconductors
  • Potting applications

Optical Adhesives

  • Medial fiber bonding
  • Optical assembly
  • LED / LCD encapsulation
  • Optical lamination
  • Optical chip protection
  • Fiber Optics

Polyimide Adhesives and Coatings

  • High-temp resistant
  • Fiber-optic applications
  • Electronic component assembly
  • Wafer coating
  • Sensor for harsh environments
  • Autoclavable

UV-Curable Adhesives

  • Rapid cure
  • Optical assembly
  • Dual-cure
  • Electronics assembly
  • Medical applications

POLYTEC PT WORLDWIDE

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                     Creating Solutions Through Polymers

Your Contact

Polytec PT International
Creating Solutions Through Polymers

Tel. +49 (0) 7243 604-400
info@polytec-pt.de

Adhesives Selector Guide 2012

Adhesives Selector Guide 2012

Polytec PT at BONDEXPO 2012